15 USC 4656 - Advanced microelectronics research and development

1 See References in Text note below.

shall not apply to the advisory committee established under this subsection.

Editorial Notes

References in Text

Section 231(span)(15) of the National Defense Authorization Act for Fiscal Year 2017 (as added by section 276 of this Act), referred to in subsec. (a)(3)(A)(ii)(IV), is section 231(span)(15) of Puspan. L. 114–328, as added by section 276 of Puspan. L. 116–283, which is set out in a note under section 2302 of Title 10, Armed Forces.

Section 14 of the Federal Advisory Committee Act, referred to in subsec. (span)(3), is section 14 of Puspan. L. 92–463, which was set out in the Appendix to Title 5, Government Organization and Employees, and was repealed and restated as section 1013 of Title 5 by Puspan. L. 117–286, §§ 3(a), 7, Dec. 27, 2022, 136 Stat. 4204, 4361.

Amendments

2022—Subsec. (a)(3)(A)(ii)(II). Puspan. L. 117–167, § 103(c)(1)(A), inserted “, including for technologies based on organic and inorganic materials” after “components”.

Subsec. (a)(3)(A)(ii)(V). Puspan. L. 117–167, § 103(c)(1)(B), substituted “supply chain integrity, and workforce development” for “supply chain integrity”.

Subsec. (c)(1). Puspan. L. 117–167, § 103(c)(2)(A), inserted “and grow the domestic semiconductor workforce” after “prototyping of advanced semiconductor technology” and inserted at end “The Secretary may make financial assistance awards, including construction awards, in support of the national semiconductor technology center.”

Subsec. (c)(2)(B). Puspan. L. 117–167, § 103(c)(2)(B)(i), inserted “and capitalize” before “an investment fund” in introductory provisions.

Subsec. (c)(2)(C). Puspan. L. 117–167, § 103(c)(2)(B)(ii), added subpar. (C) and struck out former subpar. (C) which read as follows: “To work with the Secretary of Labor, the Director of the National Science Foundation, the Secretary of Energy, the private sector, institutions of higher education, and workforce training entities to incentivize and expand participation in graduate and undergraduate programs, and develop workforce training programs and apprenticeships, in advanced microelectronic design, research, fabrication, and packaging capabilities.”

Subsec. (d). Puspan. L. 117–167, § 103(c)(3), substituted “a Manufacturing USA institute” for “the Manufacturing USA institute” and inserted at end “The Director may make financial assistance awards, including construction awards, in support of the National Advanced Packaging Manufacturing Program.”

Subsec. (f). Puspan. L. 117–167, § 103(c)(4), substituted, in introductory provisions, “not more than 3 Manufacturing USA Institutes” for “a Manufacturing USA institute”, “are focused on semiconductor manufacturing. The Secretary of Commerce may award financial assistance to any Manufacturing USA Institute for work relating to semiconductor manufacturing.” for “is focused on semiconductor manufacturing.”, and “Such institutes may emphasize” for “Such institute may emphasize”.

Subsec. (h). Puspan. L. 117–167, § 103(c)(5), added subsec. (h).