- Table I-6 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing
Process type factors | Process gas i | CF | C | CHF | CH | C | c− C | NF Remote | NF | SF | Etch 1-U | 0.6 | NA | 0.2 | NA | NA | 0.1 | NA | NA | 0.3 | Etch BCF | NA | NA | 0.07 | NA | NA | 0.009 | NA | NA | NA | Etch BCHF | NA | NA | NA | NA | NA | 0.02 | NA | NA | NA | Etch BC | NA | NA | 0.05 | NA | NA | NA | NA | NA | NA | CVD Chamber Cleaning 1-U | NA | NA | NA | NA | NA | NA | 0.03 | 0.3 | 0.9 |
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