- Table I-4 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

Table I-4 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

Process type/sub-type Process gas i CF4C2F6CHF3CH2F2CH3F C3F8C4F8NF3SF6C4F6C5F8C4F8O Etching/Wafer Cleaning1-Ui0.650.800.370.200.300.300.180.160.300.150.10NA BCF4NA0.210.0760.0600.02910.210.0450.0440.0330.0590.11NA BC2F60.058NA0.0580.0430.0090.0180.0270.0450.0410.0620.083NA BC4F80.0046NA0.00270.0540.0070NANANANA0.0051NANA BC3F8NANANANANANANANANANA0.00012NA BCHF30.012NANA0.0570.0160.0120.0280.0230.00390.0170.0069NA BCH2F20.005NA0.0024NA0.0033NA0.00210.000740.0000200.000030NANA BCH3F0.0061NA0.0270.0036NA0.000730.00630.00800.00820.00065NANA Chamber CleaningIn situ plasma cleaning1-UiNANANANANANANA0.20NANANANA BCF4NANANANANANANA0.037NANANANA BC2F6NANANANANANANANANANANANA BC3F8NANANANANANANANANANANANA Remote plasma cleaning1-UiNANANANANA0.063NA0.018NANANANA BCF4NANANANANANANA0.037NANANANA BC2F6NANANANANANANANANANANANA BC3F8NANANANANANANANANANANANA BCHF3NANANANANANANA0.000059NANANANA BCH2F2NANANANANANANA0.00088NANANANA BCH3FNANANANANANANA0.0028NANANANA BF2NANANANANANANA0.5NANANANA In situ thermal cleaning1-UiNANANANANANANA0.28NANANANA BCF4NANANANANANANA0.010NANANANA BC2F6NANANANANANANANANANANANA BC3F8NANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[89 FR 31921, Apr. 25, 2024]