- Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-type Process gas i CF4C2F6CHF3CH2F2C2HF5CH3F C3F8C4F8NF3SF6C4F6C5F8C4F8O Etching/Wafer Cleaning1-Ui0.730.720.510.130.0640.70NA0.140.190.550.0830.072NA BCF4NA0.100.0850.0790.077NANA0.110.00400.130.095NANA BC2F60.041NA0.0350.0250.0240.0034NA0.0370.0250.110.0730.014NA BC4F8NANANANANANANANANANANANANA BC3F8NANANANANANANANANANANANANA BCHF30.0910.047NA0.049NANANA0.040NA0.00120.0660.0039NA Chamber CleaningIn situ plasma cleaning1-Ui0.920.55NANANANA0.400.100.18NANANA0.14 BCF4NA0.19NANANANA0.200.110.14NANANA0.13 BC2F6NANANANANANANANANANANANA0.045 BC3F8NANANANANANANANANANANANANA Remote plasma cleaning1-UiNANANANANANANANA0.028NANANANA BCF4NANANANANANANANA0.015NANANANA BC2F6NANANANANANANANANANANANANA BC3F8NANANANANANANANANANANANANA BF2NANANANANANANANA0.5NANANANA In situ thermal cleaning1-UiNANANANANANANANANANANANANA BCF4NANANANANANANANANANANANANA BC2F6NANANANANANANANANANANANANA BC3F8NANANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[89 FR 31920, Apr. 25, 2024]