- Table I-20 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm Wafer Sizes

Table I-20 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm Wafer Sizes

Process type/sub-type Process gas i CF4C2F6CHF3CH2F2CH3F C3F8C4F8NF3SF6C4F6C5F8C4F8O Etching/Wafer Cleaning1-Ui0.680.800.350.150.340.300.160.170.280.170.10NA BCF4NA0.210.0730.0200.0380.210.0450.0350.00720.0340.11NA BC2F60.041NA0.0400.00650.00640.180.0300.0380.00170.0250.083NA BC4F60.0015NA0.00010NA0.0010NA0.00083NANANANANA BC4F80.0051NA0.00061NA0.0070NANANANANANANA BC3F8NANANANANANANANANANA0.00012NA BC5F8NANANANANANANANANANANANA BCHF30.0056NANA0.0330.00490.0120.0290.00650.00120.0190.0069NA BCH2F20.014NA0.0026NA0.0023NA0.00140.000860.0000200.000030NANA BCH3F0.00057NA0.12NANA0.00073NANA0.0082NANANA Chamber CleaningIn situ plasma cleaning1-UiNANANANANANANA0.20NANANANA BCF4NANANANANANANA0.037NANANANA BC2F6NANANANANANANANANANANANA BC3F8NANANANANANANANANANANANA Remote plasma cleaning1-UiNANANANANA0.063NA0.018NANANANA BCF4NANANANANANANA0.038NANANANA BC2F6NANANANANANANANANANANANA BC3F8NANANANANANANANANANANANA BCHF3NANANANANANANA0.000059NANANANA BCH2F2NANANANANANANA0.0016NANANANA BCH3FNANANANANANANA0.0028NANANANA In situ thermal cleaning1-UiNANANANANANANA0.28NANANANA BCF4NANANANANANANA0.010NANANANA BC2F6NANANANANANANANANANANANA BC3F8NANANANANANANANANANANANA
[89 FR 31923, Apr. 25, 2024]