- Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-19 to Subpart I of Part 98—Reference Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-type Process gas i CF4C2F6CHF3CH2F2C2HF5CH3F C3F8C4F8NF3SF6C4F6C5F8C4F8O Etching/Wafer Cleaning1-Ui0.730.460.310.370.0640.66NA0.210.200.550.0860.072NA BCF4NA0.200.100.0310.077NANA0.170.00400.0230.0089NANA BC2F60.029NANANANANANA0.065NANA0.0450.014NA BC4F6NANANANANANANANANANANANANA BC4F8NANANANANANANANANANANANANA BC3F8NANANANANANANANANANANANANA BC5F8NANANANANANANA0.016NANANANANA BCHF30.13NANANANANANANANANANA0.0039NA Chamber CleaningIn situ plasma cleaning1-Ui0.920.55NANANANA0.400.100.18NANANA0.14 BCF4NA0.19NANANANA0.200.110.14NANANA0.13 BC2F6NANANANANANANANANANANANA0.045 BC3F8NANANANANANANANANANANANANA Remote plasma cleaning1-UiNANANANANANANANA0.028NANANANA BCF4NANANANANANANANA0.015NANANANA BC2F6NANANANANANANANANANANANANA BC3F8NANANANANANANANANANANANANA In situ thermal cleaning1-UiNANANANANANANANANANANANANA BCF4NANANANANANANANANANANANANA BC2F6NANANANANANANANANANANANANA BC3F8NANANANANANANANANANANANANA
[89 FR 31923, Apr. 25, 2024]