Code of Federal Regulations

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Table I-18 to Subpart I of Part 98—Default Factors for Gamma (gi,p and gk,i,p) for Semiconductor Manufacturing and for MEMS and PV Manufacturing Under Certain Conditions * for Use With the Stack Testing Method

Process type	In-situ thermal or in-situ plasma cleaning					Remote plasma cleaning			Gas	CF4	C2F6	c-C4F8	NF3	SF6	C3F8	CF4	NF3	If manufacturing wafer sizes ≤200 mm AND manufacturing 300 mm (or greater) wafer sizes									gi	13	9.3	4.7	14	11	NA	NA	5.7	gCF4,i	NA	23	6.7	63	8.7	NA	NA	58	gC2F6,i	NA	NA	NA	NA	3.4	NA	NA	NA	gCHF3,i	NA	NA	NA	NA	NA	NA	NA	0.24	gCH2F2,i	NA	NA	NA	NA	NA	NA	NA	111	gCH3F,i	NA	NA	NA	NA	NA	NA	NA	33	If manufacturing ≤200 mm OR manufacturing 300 mm (or greater) wafer sizes									gi (≤ 200 mm wafer size)	13	9.3	4.7	2.9	11	NA	NA	1.4	gCF4,i (≤200 mm wafer size)	NA	23	6.7	110	8.7	NA	NA	36	gC2F6,i (≤200 mm wafer size)	NA	NA	NA	NA	3.4	NA	NA	NA	gi (300 mm wafer size)	NA	NA	NA	26	NA	NA	NA	10	gCF4,i (300 mm wafer size)	NA	NA	NA	17	NA	NA	NA	80	gC2F6,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	NA	gCHF3,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	0.24	gCH2F2,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	111	gCH3F,i (300 mm wafer size)	NA	NA	NA	NA	NA	NA	NA	33

* If you manufacture MEMS or PVs and use semiconductor tools and processes, you may use the corresponding g in this table. For all other tools and processes, a default g of 10 must be used.

[89 FR 31922, Apr. 25, 2024]