Note: See Note 1 to ECCN 3A090.a.
Amkor Technology, Inc.;
Ardentec Corporation;
ASE Technology Holding Co., Ltd.;
Doosan Tesna, Inc.;
Fabrinet;
Giga Solution Tech. Co., Ltd.;
GlobalFoundries, Inc.
HT Micron Semicondutores SA;
Intel Corporation;
International Business Machines Corporation (IBM);
KESM Industries Berhad;
LB Semicon, Inc.;
Micro Silicon Electronics Co., Ltd.;
Nepes Corporation;
Powertech Technology, Inc. (PTI);
QP Technologies;
Raytek Semiconductor, Inc.;
Samsung Electronics Co. Ltd.;
SFA Semicon Co., Ltd.;
Shinko Electric Industries Co. Ltd.;
Sigurd Microelectronics Corporation;
Steco Co., Ltd.;
Taiwan Semiconductor Manufacturing Company Limited (TSMC); and United Microelectronics Corporation (UMC).
[90 FR 5310, Jan. 16, 2025]
